The layered solid rapid prototyping method involves the bonding of thin layers of material, followed by cutting based on the profile of the current layer. This process accumulates layer by layer to complete the prototype, and post-processing includes removing excess material. However, removing excess material can be cumbersome and time-consuming, particularly for internal hole structures and internal cavity shapes. In some cases, it can be nearly impossible to remove all the excess material. To address these challenges, a new rapid prototyping method using double-layer thin materials has been developed and tested.
Ennex Company has introduced an innovative rapid prototyping method known as “OffsetFabrication.” This technique uses a double-layer structure for the thin materials involved. The upper layer is the material used for the prototype, while the lower layer serves as a backing or support material. Before layering, the double-layer material undergoes profile cutting, and the layers are stacked and bonded based on the current layer’s outline. After bonding, the backing material separates from the layered material, carrying away the excess material from the current layer.
This method is effective when the area that requires excess material removal is smaller than the overall layered area. However, a limitation of the OffsetFabrication method arises if the excess material’s removal area exceeds the layered area. In such cases, excess material may remain attached to the previous layer.
To address the limitations of the “OffsetFabrication” method, Inhaeng Cho proposed an improved approach to layered solid rapid prototyping. The new method still uses double-layer thin materials, but in this case, the backing material only serves a bonding function. The layered material undergoes cutting twice: first, the inner profile of holes or cavities is cut, and then the excess material from these areas is removed during the separation of the backing and layered materials. The layered material that is free of excess material continues through the process, bonding with the previously made layers. The second cutting process is then performed to cut the remaining outer profile.
This method enhances the efficiency of removing internal material from holes and cavities and simplifies the removal of excess material from the rest of the prototype. Below is a breakdown of the six steps involved in this process:
This process is repeated for each layer until the entire prototype is completed. By using this method, excess material from internal holes or cavities is efficiently removed during the manufacturing process, while the removal of excess material from the other areas of the prototype becomes much simpler.
The new double-layer thin material rapid prototyping method offers a significant improvement over previous techniques, particularly in terms of removing excess material from internal structures. By utilizing a more efficient process of cutting, bonding, and material removal, this method reduces the challenges associated with traditional LOM rapid prototyping. The result is a more streamlined and cost-effective approach to creating high-quality prototypes with intricate designs. As this method continues to evolve, it promises to further enhance the capabilities of layered solid manufacturing in various industries.